HGC MAC Meeting 11 September 2024

• Wrapping up preseries
• UCSB build 5 LD right for irradiation campaign
• CMU done with pre-series
• Waiting for hexaboards hope for Nov. Limit by ROC availability
• Calendar
  • Nov: 2 modules /day x week (one gantry tray).
  • Dec: 4/day x week (one gantry tray)
  • Jan-Feb recieve tooling and multi-module test stands
  • March: 4 /day for 4 days
  • April: 8 /day for 4 days
  • May: 12 /day for 4 days -

(What does preproduction mean ? Could go on the detector… 3b chips.. number produced still less than the number of spares)

• confirmed source of dead half chip is due to ESD damage
• Capacitance of silicon 47 pF
• Maybe apply a shunt during assembly?

• first a module with no epoxy on the perimeter has been built and thermal cycled
• All the modules built with the new glue/tape pattern do not show noisy channels identified during assembling procedure
• Covering CM capacitor with encapsulate helps protecting chips against failures - This should be done before getting hexaboard to MACs since is time consuming

• US MAC Assembly tooling order: Xometry ~16 days
• (Asia MACs Xometry also ?)

Had to leave. requested recording.

• Stresses minimal for Titanium
• Baseplate production needs to stay ahead of MAC pre-production ramp up schedule

• Nice introduction… Need to watch video

• Assembled another pre-series module: BP-Si: Transfer Tape Si-Hex: Hybrid Tape
• IV breakdown at 400V
• Exercising local and global databases